Packaging and Integration Technology in Wide Band-gap Devices based Power Electronics Converters-video

Posted:
19 May 2020
Authors:
Laili Wang
Primary Committee:
PELS
Page/Slide Count:
Time: 01:41:30
Abstract: Compared with Silicon power devices, Wide Band-gap Power Devices have many advantages, such as lower conduction loss, higher operating speed and temperature. Benefiting from these advantages, power density and efficiency of converters could be improved significantly. However, these advantages could not be fully explored because of the limitation of today’s package technology. This speech firstly addresses the challenges we are facing in package and integration of Wide Band-gap Power Devices. Then new technologies are presented to solve the key issues. Finally, corresponding integration technology of passive components are also presented.
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