Abstract: Compared with Silicon power devices, Wide Band-gap Power Devices have many advantages, such as lower conduction loss, higher operating speed and temperature. Benefiting from these advantages, power density and efficiency of converters could be improved significantly. However, these advantages could not be fully explored because of the limitation of today’s package technology. This speech firstly addresses the challenges we are facing in package and integration of Wide Band-gap Power Devices. Then new technologies are presented to solve the key issues. Finally, corresponding integration technology of passive components are also presented.
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