A Review of Advanced Power Module Packaging and Thermal Management in WBG Era-Video

Posted:
12 Nov 2019
Authors:
Fang Luo
Primary Committee:
PELS
Page/Slide Count:
Time: 1:49:00
Abstract: Wide Bandgap (WBG) devices with superior performance over traditional silicon power devices have become the prime candidates for future high-performance power electronics energy conversion. Traditional device packaging starts turning into a limiting factor in fully realizing the benefits offered by WBG power devices, and thus, improved and advanced packaging structures are required to bridge the gap between WBG devices and their applications. This talk provides a review of the state-of-art advanced module packaging technologies for SiC and GaN devices with the focuses on module layout, packaging material system, and module integration trend, and potential thermal management solutions in these WBG power electronics systems.
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